Wearable infrared temperature sensing device

ABSTRACT

A wearable device includes a case and a far infrared temperature sensing device. The case has a first opening. The far infrared temperature sensing device is disposed inside the case of the wearable device. The far infrared temperature sensing device includes an assembly structure, a sensor chip, a filter structure, and a metal shielding structure. The assembly structure has an accommodating space and a top opening. The sensor chip is disposed in the accommodating space of the assembly structure. The filter structure is disposed above the sensor chip. The metal shielding structure is disposed above the sensor chip, and has a second opening to expose the filter structure. The first and second openings are communicated to cooperatively define a through hole.

CROSS REFERENCE TO RELATED APPLICATION

This is a continuation application of U.S. application Ser. No.15/172,983, filed on Jun. 3, 2016 and entitled “WEARABLE INFRAREDTEMPERATURE SENSING DEVICE”, which is a continuation-in-part applicationof U.S. application Ser. No. 14/726,472, filed on 30 May 2015 andentitled “WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES”, theentire disclosures of both are incorporated herein by reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The instant disclosure relates to a wearable device; in particular, to awearable infrared temperature sensing device.

2. Description of Related Art

Using exercise to maintain health has become increasingly popular, andthe development of related products for self-monitoring of physiologicalstatus are more important, such as wearable or handheld consumerelectronic products, for example, fitness bracelets, smartwatches, andsmartphones. These products include biomarkers for measuring heartbeats, blood pressure, blood sugar, or blood oxygen levels, or formonitoring sleep quality. Smartwatches are the most popular wearableelectronic products.

The infrared sensors can be divided into thermal infrared sensors andquantum type infrared sensors, and thermal infrared sensors includethermocouple, thermopile, resistive thermal radiation, and pyroelectricsensor. The thermopile is an optical element for detecting temperature.The theory is that, when a temperature difference occurs on both sidesof the thermopile, it will produce electricity, and the temperaturedifference and electric energy are converted to each other. Thetechnology of thermopile is widely used in temperature detection. Italso widely used in medical temperature detection, such as the infraredthermometer applied on the ear thermometer and the forehead thermometer.Nowadays, there are many products developed dedicated to applying themedical thermopile infrared temperature sensing technology on theabovementioned wearable electronic products disposing the infraredtemperature sensor in the smartwatch, so as to detect the user's bodytemperature or the ambient temperature.

However, the smartwatch, having various measuring functions, in additionto the infrared temperature sensor, might have various sensors likeheartbeat, blood pressure, blood sugar, and blood oxygen levels that aredisposed in the same space simultaneously. Furthermore there areexternal electronic signals, such that the internal and external signalsinterfere with each other, so as to decrease the detection accuracy.Therefore, solving the problem of noise signals generated among thevarious sensors and the external electronic products is one of theimportant issues in the art.

SUMMARY OF THE INVENTION

The instant disclosure addresses the technical problem of providing awearable device which includes a far infrared temperature sensing devicecontaining a metal shielding structure to block the noise generated fromother sensors and external electronic products, and to block other farinfrared from passing into the case of the wearable device avoidinginterference with the sensing device, so as to increase the detectionaccuracy on the far infrared temperature.

To address the abovementioned technical problem, one of the embodimentsof this instant disclosure provides a wearable device including a caseand a far infrared temperature sensing device. The case has a firstopening. The far infrared temperature sensing device is disposed insidethe case of the wearable device. The far infrared temperature sensingdevice includes an assembly structure, a sensor chip, a filterstructure, and a metal shielding structure. The assembly structure hasan accommodating space and a top opening. The sensor chip is disposed inthe accommodating space of the assembly structure. The filter structureis disposed above the sensor chip. The metal shielding structure isdisposed above the sensor chip, and has a second opening to expose thefilter structure. The first and second openings are communicated tocooperatively define a through hole.

Another embodiment of this instant disclosure provides a wearable deviceincluding a case and a far infrared temperature sensing device. The casehas a first opening. The far infrared temperature sensing device isdisposed inside the case of the wearable device, and the far infraredtemperature sensing device includes a circuit substrate, an assemblystructure, a sensor chip, and a filter structure. The circuit substrateis disposed in the case, contains a metal shielding structure, and has asecond opening. The assembly structure is disposed below the circuitsubstrate, and has an accommodating space and a top opening. The sensorchip is disposed in the accommodating space of the assembly structure.The filter structure is disposed at the top opening of the assemblystructure and is located above the sensor chip to enclose theaccommodating space of the assembly structure. The first and secondopenings are communicated to cooperatively define a through hole.

Yet another embodiment of this instant disclosure provides a wearabledevice including a case and a far infrared temperature sensing device.The case has a first opening. The far infrared temperature sensingdevice is disposed inside the case of the wearable device, and the farinfrared temperature sensing device includes a circuit substrate, asensor chip, a filter structure, and a metal shielding structure. Thecircuit substrate is disposed in the case. The sensor chip is disposedon the circuit substrate. The filter structure is disposed on the sensorchip. The metal shielding structure is disposed in the case and locatedabove the filter structure, and has a second opening to expose thefilter structure. The first and second openings are communicated tocooperatively define a through hole.

Yet another embodiment of this instant disclosure provides a wearabledevice including a case and a far infrared temperature sensing device.The case has a first opening. The far infrared temperature sensingdevice is disposed inside the case of the wearable device, and the farinfrared temperature sensing device includes an assembly structure, asensor chip, a filter structure, and a metal shielding structure. Thesensor chip is disposed on the assembly structure. The filter structureis disposed above the sensor chip. The metal shielding structure isdisposed on the assembly structure, surrounds the assembly structure andthe filter structure, and has a second opening to expose the filterstructure.

This instant disclosure has the benefit that the metal shieldingstructure surrounding the internal sensing elements (e.g., sensor chip,circuit substrate) in the far infrared temperature sensing device of thewearable device can block the noise generated from other sensors andexternal electronic products that can interfere with the sensingelements, and blocks other far infrared from passing into the case ofthe wearable device avoiding the sensing result of the sensor chip frombeing affected, so as to increase the detection accuracy on the farinfrared temperature. The metal shielding structure further has anopening, which only allows the infrared at a certain position to enter,and other parts outside the opening are blocked by the metal shieldingstructure and cannot enter into the wearable device. In this way, it canhave a superior Signal-to-Noise Ratio (SNR). Meanwhile, the detectionaccuracy on the far infrared temperature can be increased.

In order to further appreciate the characteristics and technicalcontents of the present invention, references are hereunder made to thedetailed descriptions and appended drawings in connection with theinstant disclosure. However, the appended drawings are merely shown forexemplary purposes, rather than being used to restrict the scope of theinstant disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a schematic view of a wearable device of a first embodimentin the instant disclosure;

FIG. 2 shows a schematic view of a wearable device of a secondembodiment in the instant disclosure;

FIG. 3 shows a schematic view of a wearable device of a third embodimentin the instant disclosure;

FIG. 4 shows a schematic view of a wearable device of a fourthembodiment in the instant disclosure;

FIG. 5 shows a schematic view of a wearable device of a fifth embodimentin the instant disclosure;

FIG. 6 shows a schematic view of a wearable device of a sixth embodimentin the instant disclosure;

FIG. 7 shows a schematic view of a wearable device of a seventhembodiment in the instant disclosure;

FIG. 8 shows a schematic view of a wearable device of an eighthembodiment in the instant disclosure;

FIG. 9 shows a schematic view of a wearable device of a ninth embodimentin the instant disclosure;

FIG. 10 shows a schematic view of a wearable device of a tenthembodiment in the instant disclosure;

FIG. 11 shows a schematic view of a wearable device of an eleventhembodiment in the instant disclosure;

FIG. 12 shows a schematic view of a wearable device of a twelfthembodiment in the instant disclosure;

FIG. 13 shows a schematic view of a wearable device of a thirteenthembodiment in the instant disclosure;

FIG. 14 shows a schematic view of a wearable device of a fourteenthembodiment in the instant disclosure;

FIG. 15 shows a schematic view of a wearable device of a fifteenthembodiment in the instant disclosure;

FIG. 16 shows a schematic view of a wearable device of a sixteenthembodiment in the instant disclosure;

FIG. 17 shows a schematic view of a wearable device of a seventeenthembodiment in the instant disclosure;

FIG. 18 shows a schematic view of a wearable device of an eighteenthembodiment in the instant disclosure;

FIG. 19 shows a schematic view of a wearable device of a nineteenthembodiment in the instant disclosure;

FIG. 20 shows a schematic view of a wearable device of a twentiethembodiment in the instant disclosure; and

FIG. 21 shows a schematic view of a wearable device of a twenty firstembodiment in the instant disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Embodiments of wearable device disclosed in the instant disclosure areillustrated via specific examples as follows, and people familiar in theart may easily understand the advantages and efficacies of the instantdisclosure by disclosure of the specification. The instant disclosuremay be implemented or applied by other different specific examples, andeach of the details in the specification may be applied based ondifferent views and may be modified and changed under the existence ofthe spirit of the instant disclosure. The figures in the instantdisclosure are only for brief description, but they are not depictedaccording to actual size and do not reflect the actual size of therelevant structure. The following embodiments further illustrate relatedtechnologies of the instant disclosure in detail, but the scope of theinstant disclosure is not limited herein.

First Embodiment

Please refer to FIG. 1. FIG. 1 shows a schematic view of a wearabledevice D1 of a first embodiment in the instant disclosure. The firstembodiment of this instant disclosure provides a wearable device D1which includes a case 1 and a far infrared temperature sensing device F.The case 1 has a first opening O1. The far infrared temperature sensingdevice F is disposed inside the case 1 of the wearable device D1, andincludes a circuit substrate 2, an assembly structure 3, a sensor chip4, a filter structure 5, a metal shielding structure 6, and a waterproofstructure 7. The circuit substrate 2 is disposed in the case 1. Theassembly structure 3 is disposed on the circuit substrate 2, and has anaccommodating space R and a top opening OT. The sensor chip 4 isdisposed in the accommodating space R of the assembly structure 3, andis electrically connected to the assembly structure 3 by at least onewire W (wire bonding). The filter structure 5 is disposed above thesensor chip 4, and at the top opening OT of the assembly structure 3 toenclose the accommodating space R of the assembly structure 3. The metalshielding structure 6 is disposed on the circuit substrate 2, and has asecond opening O2 to expose the filter structure 5. The waterproofstructure 7 is surroundingly disposed in the metal shielding structure 6and located above the filter structure 5, and has a has a third openingO3 to expose the filter structure 5. The first opening O1 and the secondopening O2 are communicated to cooperatively define a through hole H,and the third opening O3 and the through hole H are communicated witheach other.

Specifically, the case 1 can be a watch case of a smartwatch. Thecircuit substrate 2 can be a Printed Circuit Board (PCB). The assemblystructure 3 can be a Surface-Mount Devices (SMD) substrate or a CeramicLeadless Chip Carrier (CLCC) substrate. The sensor chip 4 is a farinfrared sensor chip, and the complementary metal oxide semiconductormicro-electromechanical systems (CMOS MEMS) process can be used in thesensor chip 4.

In particular, the sensor chip 4 is mainly used to detect the FarInfrared (FIR) which has a wavelength ranging from 15 to 1000 μm. Sinceliving organisms feel heat approximately in this wave band at roomtemperature, the sensor chip 4 is used to detect the temperature of thethermal radiation generated from the far infrared in this embodiment.

Moreover, the filter structure 5 can be a far infrared filter which canallow the far infrared to pass through. In this embodiment, the metalshielding structure 6 in addition can be used to block the noisegenerated from other sensors and external electronic products, and itfurther can prevent other far infrared from passing through into thecase 1 of the wearable device D1 to affect the sensing results of thesensor chip 4 and to decrease the temperature detection accuracy.Particularly, the material of the metal shielding structure 6 isselected from the group consisting of silver, copper, aluminum, iron,and other materials which can block the noise, but the material of themetal shielding structure 6 is not limited in this instant disclosure.In addition, the waterproof structure 7 can be a waterproof glue or awaterproof layer that can prevent moisture entering into the wearabledevice D1 of this instant disclosure to cause corrosion and rusting ofthe element, and also can prevent the particles in the air entering intothe wearable device D1 of this instant disclosure to avoid the elementsuffering from abrasion by particles in the air, so as to lengthen thelifetime of the product. The material of the waterproof structure 7 isselected from a group consisting of silica gel, polyurethane (PU), andepoxy resin.

In the first embodiment of this instant disclosure, the case 1 has thefirst opening O1, the metal shielding structure 6 has the second openingO2, the waterproof structure 7 has the third opening O3, the main reasonbeing that, when the user wears the wearable device D1 of this instantdisclosure (e.g., smartwatch), the thermal radiation generated from thebody that is in the far infrared which can pass through these openings(through hole H and third opening O3) to enter into the far infraredtemperature sensing device F of the wearable device D1, the filterstructure 5 can filter out other visible light and only allow the farinfrared to pass through the filter structure 5 and enter into theaccommodating space R, and the sensor chip 4 receives the far infraredto further conduct the temperature detection.

Second Embodiment

Please refer to FIG. 2. FIG. 2 shows a schematic view of a wearabledevice D2 of a second embodiment in the instant disclosure. The wearabledevice D2 of the second embodiment of this instant disclosure has asimilar package structure to the wearable device D1 of the firstembodiment of this instant disclosure, and the similar elements refer tothe above description. The difference between the wearable device D2 ofthe second embodiment and the wearable device D1 of the first embodimentin this instant disclosure is that, the wearable device D2 of the secondembodiment in this instant disclosure further includes an infraredpassing glue 8 which is used to fill the through hole H and the thirdopening O3, and is used to filter out the non-infrared light.

In the second embodiment of this instant disclosure, the through hole Hformed by the first opening O1 of the case 1, the second opening O2 ofthe metal shielding structure 6, and the third opening O3 of thewaterproof structure 7 are filled by the infrared passing glue 8 andenclosed, preventing the particles from water vapor and air enteringinto the wearable device D2 causing corrosion and abrasion, so as tolengthen the lifetime of the product. When the user wears the wearabledevice D2 of this instant disclosure (e.g., smartwatch), the thermalradiation generated from the body that is far infrared can pass throughthe infrared passing glue 8 to enter into the far infrared temperaturesensing device F of the wearable device D2. The infrared passing glue 8can filter out the non-infrared light, and the filter structure 5further filters out the residual non-infrared light and only allows thefar infrared to pass through and enter into the accommodating space R ofthe assembly structure 3, and the sensor chip 4 receives the farinfrared to further conduct the temperature detection.

Third Embodiment

Please refer to FIG. 3. FIG. 3 shows a schematic view of a wearabledevice D3 of a third embodiment in the instant disclosure. The wearabledevice D3 of the third embodiment of this instant disclosure has similarpackage structure with the wearable device D1 of the first embodiment ofthis instant disclosure, and for similar elements refer to the abovedescription, identical numerals are used throughout the specificationand figures that represent identical structure have identicalapplication, function, and are selected from identical materials.

The difference between the wearable device D3 of the third embodimentand the wearable device D1 of the first embodiment in this instantdisclosure is that, the wearable device D3 of the third embodiment inthis instant disclosure further includes an infrared passing structure 9which is disposed at the top opening OT of the assembly structure 3 toenclose the accommodating space R of the assembly structure 3, and thefilter structure 5 is disposed between the infrared passing structure 9and the waterproof structure 7. In order to allow the far infraredpassing through the infrared passing structure 9, the material of theinfrared passing structure 9 must be a transparent material which is thesame as the infrared passing glue 8 of the second embodiment in thisinstant disclosure, that is selected from the group consisting ofpolyethylene (PE), polypropylene/polypropene (PP), or polyethyleneterephthalate (PET), and other material which can allow the far infraredto pass through, and the infrared passing structure 9 is mainly used tofilter out the non-infrared light.

In the third embodiment of this instant disclosure, the through hole Hformed by the first opening O1 of the case 1 and the second opening O2of the metal shielding structure 6, and the third opening O3 of thewaterproof structure 7 can allow the far infrared to pass through, whenthe user wears the wearable device D3 of this instant disclosure (e.g.,smartwatch), the thermal radiation generated from the body that is inthe far infrared spectrum which can pass through the through hole H toenter into the far infrared temperature sensing device F of the wearabledevice D3. The filter structure 5 can filter out the visible light andallow the far infrared, the far infrared passes through the infraredpassing structure 9 which further filters out the residual non-infraredlight, the far infrared then enters into the accommodating space R ofthe assembly structure 3, and the sensor chip 4 receives the farinfrared to further conduct the temperature detection.

Fourth Embodiment

Please refer to FIG. 4. FIG. 4 shows a schematic view of a wearabledevice D4 of a fourth embodiment in the instant disclosure. The wearabledevice D4 of the fourth embodiment of this instant disclosure hassimilar package structure with the wearable device D3 of the thirdembodiment of this instant disclosure.

The difference between the wearable device D4 of the fourth embodimentand the wearable device D3 of the third embodiment in this instantdisclosure is that, the wearable device D4 of the fourth embodiment inthis instant disclosure further includes an infrared passing glue 8which is used to fill the through hole H and the third opening O3 toenclose the through hole H and the third opening O3.

In the fourth embodiment of this instant disclosure, the through hole Hformed by the first opening O1 of the case 1 and the second opening O2of the metal shielding structure 6, and the third opening O3 of thewaterproof structure 7 are filled by the infrared passing glue 8 andenclosed, and prevent water vapor and air entering into the wearabledevice D4 causing corrosion and abrasion, so as to lengthen the lifetimeof the product. When the user wears the wearable device D4 of thisinstant disclosure (e.g., smartwatch), the thermal radiation generatedfrom the body that is far infrared can pass through the infrared passingglue 8 to enter into the far infrared temperature sensing device F ofthe wearable device D4. The infrared passing glue 8 can filter out thenon-infrared light, the filter structure 5 further filters out othervisible light and allows the far infrared, the far infrared then passesthrough the infrared passing structure 9 and enters into theaccommodating space R of the assembly structure 3, and the sensor chip 4receives the far infrared to further conduct the temperature detection.

Fifth Embodiment

Please refer to FIG. 5. FIG. 5 shows a schematic view of a wearabledevice D5 of a fifth embodiment in the instant disclosure. The wearabledevice D5 of the fifth embodiment of this instant disclosure has asimilar package structure with the wearable device D3 of the thirdembodiment of this instant disclosure.

The difference between the wearable device D5 of the fifth embodimentand the wearable device D3 of the third embodiment in this instantdisclosure is that, the infrared passing structure 9 of the wearabledevice D5 of the fifth embodiment in this instant disclosure is disposedbetween the filter structure 5 and the waterproof structure 7, and thefilter structure 5 is disposed at the top opening OT of the assemblystructure 3 to enclose the accommodating space R of the assemblystructure 3. Similarly, in order to allow the far infrared to passthrough the infrared passing structure 9, the material of the infraredpassing structure 9 also must be a transparent material, and thematerial is the same as the infrared passing structure 9 of the thirdembodiment in this instant disclosure.

In the fifth embodiment of this instant disclosure, the through hole Hformed by the first opening O1 of the case 1 and the second opening O2of the metal shielding structure 6, and the third opening O3 of thewaterproof structure 7 can allow the far infrared to pass through, andwhen the user wears the wearable device D5 of this instant disclosure(e.g., smartwatch), the thermal radiation generated from the body thatis the far infrared can pass through the through hole H to enter intothe far infrared temperature sensing device F of the wearable device D5.First, the far infrared passes through the infrared passing structure 9which filters the non-infrared light, the filter structure 5 thenfilters out the visible light, only the far infrared can pass throughand enter into the accommodating space R of the assembly structure 3,and the sensor chip 4 receives the far infrared to further conduct thetemperature detection.

Sixth Embodiment

Please refer to FIG. 6. FIG. 6 shows a schematic view of a wearabledevice D6 of a sixth embodiment in the instant disclosure. The wearabledevice D6 of the sixth embodiment of this instant disclosure has similarpackage structure with the wearable device D5 of the fifth embodiment ofthis instant disclosure.

The difference between the wearable device D6 of the sixth embodimentand the wearable device D5 of the fifth embodiment in this instantdisclosure is that, the wearable device D6 of sixth embodiment in thisinstant disclosure further includes an infrared passing glue 8 which isused to fill the through hole H and the third opening O3 to enclose thethrough hole H and the third opening O3.

In the sixth embodiment of this instant disclosure, the through hole Hformed by the first opening O1 of the case 1 and the second opening O2of the metal shielding structure 6, and the third opening O3 of thewaterproof structure 7 are filled by the infrared passing glue 8 andenclosed, and it can further enhance the product to prevent water vaporand air entering into the wearable device D6 causing corrosion andabrasion, so as to lengthen the lifetime of the product. When the userwears the wearable device D6 of this instant disclosure (e.g.,smartwatch), the thermal radiation generated from the body that is thefar infrared can pass through the infrared passing glue 8 to enter intothe far infrared temperature sensing device F of the wearable device D6.The far infrared passes through the infrared passing structure 9 first,the infrared passing structure 9 filters out the non-infrared light, thefilter structure 5 further filters out other visible light and allowsthe far infrared, only the far infrared can pass through and enter intothe accommodating space R of the assembly structure 3, and the sensorchip 4 receives the far infrared to further conduct the temperaturedetection.

Seventh Embodiment

Please refer to FIG. 7. FIG. 7 shows a schematic view of a wearabledevice D7 of a seventh embodiment in the instant disclosure. Thewearable device D7 of the seventh embodiment of this instant disclosurehas similar package structure with the wearable device D1 of the firstembodiment of this instant disclosure.

The difference between the wearable device D7 of the seventh embodimentand the wearable device D1 of the first embodiment in this instantdisclosure is that, the case 1 of the wearable device D7 of the seventhembodiment in this instant disclosure can be an isolation structure 10which covers the metal shielding structure 6 to prevent water vapor andparticles in the air entering into the wearable device D7 causingcorrosion and abrasion, so as to lengthen the lifetime of the product.The material of the isolation structure 10 is selected from the groupconsisting of silica gel, PU, epoxy resin, and other material which canbe used to prevent water from entering.

In the seventh embodiment of this instant disclosure, the isolationstructure 10 has an opening, that is the first opening O1 of the case 1,and the far infrared passes through this opening. When the user wearsthe wearable device D7 of this instant disclosure (e.g., smartwatch),the thermal radiation generated from the body that is far infrared canpass through the opening (first opening O1) of isolation structure 10 toenter into the far infrared temperature sensing device F of the wearabledevice D7. The filter structure 5 filters out other visible light andallows the far infrared, the far infrared passes through the filterstructure 5 to enter into the accommodating space R of the assemblystructure 3, and the sensor chip 4 receives the far infrared to furtherconduct the temperature detection.

Eighth Embodiment

Please refer to FIG. 8. FIG. 8 shows a schematic view of a wearabledevice D8 of an eighth embodiment in the instant disclosure. Thewearable device D8 of the eighth embodiment of this instant disclosurehas similar package structure to the wearable device D1 of the firstembodiment of this instant disclosure.

The difference between the wearable device D8 of the eighth embodimentand the wearable device D1 of the first embodiment in this instantdisclosure is that, the case 1 of the wearable device D8 of the eighthembodiment in this instant disclosure can be an infrared passingstructure 9 which completely covers the metal shielding structure 6. Inthe eighth embodiment in this instant disclosure, the case 1 has noopening, hence there is no the first opening O1, and the second openingO2 of the metal shielding structure 6 and the third opening O3 of thewaterproof structure 7 are also covered by the infrared passingstructure 9, so as to enhance the waterproofing and the dust preventioneffect. By disposing the means of the infrared passing structure 9 inthe eighth embodiment, particles in the water vapor and the air can beprevented from entering into the wearable device D8 causing corrosionand abrasion by these particles, so as to lengthen the lifetime of theproduct.

In the eighth embodiment of this instant disclosure, when the user wearsthe wearable device D8 of this instant disclosure (e.g., smartwatch),the thermal radiation generated from the body that is the far infraredcan pass through the infrared passing structure 9 to enter into the farinfrared temperature sensing device F of the wearable device D8. Theinfrared passing structure 9 can filter out the non-infrared lightfirst, the filter structure 5 further filters out other visible lightand allows the far infrared, only the far infrared passes though thefilter structure 5 and enters into the accommodating space R of theassembly structure 3, and the sensor chip 4 receives the far infrared tofurther conduct the temperature detection.

Ninth Embodiment

Please refer to FIG. 9. FIG. 9 shows a schematic view of a wearabledevice D9 of a ninth embodiment in the instant disclosure. The wearabledevice D9 of the ninth embodiment of this instant disclosure has similarpackage structure with the wearable device D1 of the first embodiment ofthis instant disclosure.

The difference between the wearable device D9 of the ninth embodimentand the wearable device D1 of the first embodiment in this instantdisclosure is that, the filter structure 5 of the wearable device D9 ofthe eighth embodiment in this instant disclosure is disposed inside theaccommodating space R of the assembly structure 3, and the top openingOT of the assembly structure 3, the through hole H, and the thirdopening O3 are communicated with each other.

In the ninth embodiment of this instant disclosure, the through hole Hformed by the first opening O1 of the case 1 and the second opening O2of the metal shielding structure 6, the third opening O3 of thewaterproof structure 7, and the communicated top opening OT of theassembly structure 3 can cooperatively allow the far infrared to passthrough. When the user wears the wearable device D9 of this instantdisclosure (e.g., smartwatch), the thermal radiation generated from thebody that is the far infrared can pass through the through hole H andthe top opening OT of the assembly structure 3 and directly enter intothe accommodating space R of the assembly structure 3 of the farinfrared temperature sensing device F of the wearable device D9. Thefilter structure 5 filters out other visible light and allows the farinfrared to pass through, the sensor chip 4 receives the far infraredwhich has passed through the filter structure 5, and the temperaturedetection is conducted.

Tenth Embodiment

Please refer to FIG. 10. FIG. 10 shows a schematic view of a wearabledevice D10 of a tenth embodiment in the instant disclosure. The wearabledevice D10 of the tenth embodiment of this instant disclosure has asimilar package structure with the wearable device D9 of the ninthembodiment of this instant disclosure.

The difference between the wearable device D10 of the tenth embodimentand the wearable device D9 of the ninth embodiment in this instantdisclosure is that, the wearable device D10 of the tenth embodiment inthis instant disclosure further includes an infrared passing structure 9which is disposed inside the accommodating space R of the assemblystructure 3 to completely cover the sensor chip 4 and the filterstructure 5, and to enclose the through hole H, the third opening O3,and the top opening OT of the assembly structure 3. The disposing meansof the infrared passing structure 9 in the tenth embodiment can enhancethe product to prevent water and particles in the air from entering intothe wearable device D10 of this instant disclosure to avoid causingcorrosion and abrasion, so as to lengthen the lifetime of the product.

In the tenth embodiment of this instant disclosure, when the user wearsthe wearable device D10 of this instant disclosure (e.g., smartwatch),the thermal radiation generated from the body that is the far infraredcan pass through the infrared passing structure 9 to enter into the farinfrared temperature sensing device F of the wearable device D10. Theinfrared passing structure 9 can filter out the non-infrared lightfirst, the filter structure 5 further filters out other visible lightand allows the far infrared to pass through, the sensor chip 4 receivesthe far infrared which has passed through the filter structure 5, andthe temperature detection is conducted.

Eleventh Embodiment

Please refer to FIG. 11. FIG. 11 shows a schematic view of a wearabledevice D11 of an eleventh embodiment in the instant disclosure. Thewearable device D11 of the eleventh embodiment of this instantdisclosure has similar package structure with the wearable device D9 ofthe ninth embodiment of this instant disclosure.

The difference between the wearable device D11 of the eleventhembodiment and the wearable device D9 of the ninth embodiment in thisinstant disclosure is that, the wearable device D11 of the eleventhembodiment in this instant disclosure further includes a waterprooflayer 11 which is surroundingly disposed below the top opening OT of theassembly structure 3 and located above the filter structure 5. Thewaterproof layer 11 has a fourth opening O4 to expose the filterstructure 5, and the fourth opening O4, the through hole H, and thethird opening O3 are communicated with each other. The disposing meansof the waterproof layer 11 in the eleventh embodiment can enhance thewaterproof effect of the wearable device D11 of this instant disclosure.The material of the waterproof layer 11 is selected from the groupconsisting of silica gel, PU, epoxy resin, and other material which canbe used to prevent water.

In the eleventh embodiment of this instant disclosure, the through holeH formed by the first opening O1 of the case 1 and the second opening O2of the metal shielding structure 6, the third opening O3 of thewaterproof structure 7, and the communicated fourth opening O4 of thewaterproof layer 11 can cooperatively allow the far infrared to passthrough. When the user wears the wearable device D11 of this instantdisclosure (e.g., smartwatch), the thermal radiation generated from thebody that is the far infrared can pass through the through hole H, thethird opening O3, and the fourth opening O4 of the waterproof layer 11,and directly pass through the filter structure 5. The filter structure 5filters out other visible light and allows the far infrared, and thesensor chip 4 receives the far infrared to further conduct thetemperature detection.

Twelfth Embodiment

Please refer to FIG. 12. FIG. 12 shows a schematic view of a wearabledevice D12 of a twelfth embodiment in the instant disclosure. Thewearable device D12 of the twelfth embodiment of this instant disclosurehas a similar package structure with the wearable device D11 of theeleventh embodiment of this instant disclosure.

The difference between the wearable device D12 of the twelfth embodimentand the wearable device D11 of the eleventh embodiment in this instantdisclosure is that, the wearable device D12 of the twelfth embodiment inthis instant disclosure further includes an infrared passing glue 8which is used to fill the through hole H and the third opening O3. Theinfrared passing glue 8 is used to fill into the through hole H, thethird opening O3, and the fourth opening O4 to enclose the through holeH, the third opening O3, and the fourth opening O4.

In the twelfth embodiment of this instant disclosure, the through hole Hformed by the first opening O1 of the case 1 and the second opening O2of the metal shielding structure 6, the third opening O3 of thewaterproof structure 7, and the fourth opening O4 of the waterprooflayer 11 are cooperatively filled by the infrared passing glue 8 andenclosed, to prevent water vapor and air particles from entering intothe wearable device D12 causing corrosion and abrasion, so as tolengthen the lifetime of the product. When the user wears the wearabledevice D12 of this instant disclosure (e.g., smartwatch), the thermalradiation generated from the body that is the far infrared can passthrough the infrared passing glue 8 to enter into the far infraredtemperature sensing device F of the wearable device D12. The infraredpassing glue 8 can filter out the non-infrared light, the filterstructure 5 further filters out other visible light and only allows thefar infrared to pass through, and the sensor chip 4 receives the farinfrared which has passed through the filter structure 5 to furtherconduct the temperature detection.

Thirteenth Embodiment

Please refer to FIG. 13. FIG. 13 shows a schematic view of a wearabledevice D13 of a thirteenth embodiment in the instant disclosure. Thethirteenth embodiment of this instant disclosure provides a wearabledevice D13 which includes a case 1 and a far infrared temperaturesensing device F. The case 1 has a first opening O1. The far infraredtemperature sensing device F is disposed inside the case 1 of thewearable device D13, and includes a circuit substrate 2, an assemblystructure 3, a sensor chip 4, a filter structure 5, and a waterproofstructure 7. The circuit substrate 2 is disposed in the case 1, containsa metal shielding structure 6, and has a second opening O2. The assemblystructure 3 is disposed below the circuit substrate 2, and has anaccommodating space R and a top opening OT. The sensor chip 4 isdisposed in the accommodating space R of the assembly structure 3. Thecircuit substrate 2, the assembly structure 3, and the sensor chip 4 areelectrically connected to each other by at least one wire W. The filterstructure 5 is disposed at the top opening OT of the assembly structure3 and located above the sensor chip 4 to enclose the accommodating spaceR of the assembly structure 3. The waterproof structure 7 issurroundingly disposed between the circuit substrate 2 and the filterstructure 5, and the waterproof structure 7 has a third opening O3 toexpose the filter structure 5. The first opening O1 and the secondopening O2 are communicated to cooperatively define a through hole H,and the third opening O3 and the through hole H are communicated witheach other.

Specifically, the case 1 can be a watch case of a smartwatch. Thecircuit substrate 2 can be a PCB. The metal shielding structure 6disposed in the circuit substrate 2 is in addition used to block thenoise generated from other sensors and external electronic products, andit further can prevent other far infrared from passing into the case 1of the wearable device D13 to affect the sensing results of the sensorchip 4 and to avoid the noise interfering with the far infraredtemperature sensing device F of the wearable device D13 to decrease thetemperature detection accuracy when detecting the temperature.Particularly, the material of the metal shielding structure 6 isselected from the group consisting of silver, copper, aluminum, iron,and other materials which can block the noise. The assembly structure 3can be a SMD substrate or a CLCC substrate. The sensor chip 4 is a farinfrared sensor chip, and the CMOS MEMS process can be used in thesensor chip 4.

In particular, the sensor chip 4 is mainly used to detect the farinfrared which has a wavelength ranging from 15 to 1000 μm. Since theliving organism feels heat approximately in this wave band at roomtemperature, the sensor chip 4 is used to detect the temperature of thethermal radiation generated from the far infrared in this embodiment.

Moreover, the filter structure 5 can be a far infrared filter which canallow the far infrared to pass through. Additionally, the waterproofstructure 7 can be a waterproof glue or a waterproof layer that canprevent moisture from entering into the wearable device D13 of thisinstant disclosure to cause corrosion and rusting of the element, andalso can prevent the particles in the air from entering into thewearable device D13 to avoid abrasion, so as to lengthen the lifetime ofthe product. The material of the waterproof structure 7 is selected fromthe group consisting of silica gel, PU, and epoxy resin.

In the thirteenth embodiment of this instant disclosure, the case 1 hasthe first opening O1, the circuit substrate 2 has the second opening O2,the waterproof structure 7 has the third opening O3, the main reasonbeing that, when the user wears the wearable device D13 of this instantdisclosure (e.g., smartwatch), the thermal radiation generated from thebody that is the far infrared can pass through these openings (throughhole H and third opening O3) to enter into the filter structure 5. Thefilter structure 5 can filter out other visible light and only allow thefar infrared to pass through the filter structure 5 and enter into theaccommodating space R of the assembly structure 3, and the sensor chip 4receives the far infrared to further conduct the temperature detection.

The difference between this embodiment and the abovementionedembodiments is, in the thirteenth embodiment of this instant disclosure,the circuit substrate 2 is reversely disposed below the case 1 of thewearable device D13, since the circuit substrate 2 has a metal structurewhich can be directly used as the metal shielding structure 6, and it isnot necessary to dispose one more metal shielding structure 6. By thisdesign of the thirteenth embodiment of this instant disclosure canreduce the manufacturing cost.

Fourteenth Embodiment

Please refer to FIG. 14. FIG. 14 shows a schematic view of a wearabledevice D14 of a fourteenth embodiment in the instant disclosure. Thewearable device D14 of the fourteenth embodiment of this instantdisclosure has a similar package structure with the wearable device D13of the thirteenth embodiment of this instant disclosure.

The difference between the wearable device D14 of the fourteenthembodiment and the wearable device D13 of the thirteenth embodiment inthis instant disclosure is that, the wearable device D14 of thefourteenth embodiment further includes an infrared passing glue 8 whichis used to fill the through hole H and the third opening O3. Theinfrared passing glue 8 is used to fill into the through hole H and thethird opening O3 to enclose the through hole H and the third opening O3,and is mainly used to filter out the non-infrared light. The material ofthe infrared passing glue 8 is the same as the abovementionedembodiments.

In the fourteenth embodiment of this instant disclosure, the throughhole H formed by the first opening O1 of the case 1 and the secondopening O2 of the metal shielding structure 6, and the third opening O3of the waterproof structure 7 are filled by the infrared passing glue 8and enclosed, to prevent water vapor and air particles entering into thewearable device D14 causing corrosion and abrasion, so as to lengthenthe lifetime of the product. When the user wears the wearable device D14of this instant disclosure (e.g., smartwatch), the thermal radiationgenerated from the body that is the far infrared can pass through thefilter structure 5 via the infrared passing glue 8. The infrared passingglue 8 can filter out the non-infrared light, the filter structure 5further filters out other visible light and only allows the far infraredto pass through and enter into the accommodating space R of the assemblystructure 3, and the sensor chip 4 receives the far infrared to furtherconduct the temperature detection.

Fifteenth Embodiment

Please refer to FIG. 15. FIG. 15 shows a schematic view of a wearabledevice D15 of a fifteenth embodiment in the instant disclosure. Thefifteenth embodiment of this instant disclosure provides a wearabledevice D15 which includes a case 1 and a far infrared temperaturesensing device F. The case 1 has a first opening O1. The far infraredtemperature sensing device F is disposed inside the case 1 of thewearable device D15, and includes a circuit substrate 2, a sensor chip4, a filter structure 5, a metal shielding structure 6, and a waterproofstructure 7. The circuit substrate 2 is disposed in the case 1. Thesensor chip 4 is disposed on the circuit substrate 2, and electricallyconnected to the circuit substrate 2 by at least one solder B (flip-chipbonding). The filter structure 5 is disposed on the sensor chip 4. Themetal shielding structure 6 is disposed in the case 1 and located abovethe filter structure 5, and has a second opening O2 to expose the filterstructure 5. The waterproof structure 7 is surroundingly disposed in themetal shielding structure 6 and between the metal shielding structure 6and the filter structure 5, and has a third opening O3 to expose thefilter structure 5. The first opening O1 and the second opening O2 arecommunicated to cooperatively define a through hole H, and the thirdopening O3 and the through hole H are communicated with each other.

Specifically, the case 1 can be a watch case of a smartwatch. Thecircuit substrate 2 can be a PCB. The sensor chip 4 is a far infraredsensor chip, and the CMOS MEMS process can be used in the sensor chip 4.

In particular, the sensor chip 4 is mainly used to detect the farinfrared which has a wavelength ranging from 15 to 1000 μm. Since livingorganisms feel the heat approximately in this wave band at roomtemperature, the sensor chip 4 is used to detect the temperature of thethermal radiation generated from the far infrared.

Moreover, the filter structure 5 can be a far infrared filter which canallow the far infrared to pass through. In this embodiment, the metalshielding structure 6 in addition can be used to block the noisegenerated from other sensors and external electronic products, andfurther can prevent other far infrared from passing into the case 1 ofthe wearable device D15 to affect the sensing results of the sensor chip4 and to decrease the temperature detection accuracy. Particularly, thematerial of the metal shielding structure 6 is selected from the groupconsisting of silver, copper, aluminum, iron, and other materials whichcan block the noise, but the material of the metal shielding structure 6is not limited in this instant disclosure. Additionally, the waterproofstructure 7 can be a waterproof glue or a waterproof layer that canprevent moisture entering into the wearable device D15 of this instantdisclosure causing corrosion and rusting of the product, and also canprevent the particles in the air entering into the wearable device D15of this instant disclosure to avoid the product suffering from abrasionby air particles, so as to lengthen the lifetime of the product. Thematerial of the waterproof structure 7 is selected from the groupconsisting of silica gel, PU, and epoxy resin.

In the fifteenth embodiment of this instant disclosure, the case 1 hasthe first opening O1, the metal shielding structure 6 has the secondopening O2, the waterproof structure 7 has the third opening O3, themain reason being that, when the user wears the wearable device D15 ofthis instant disclosure (e.g., smartwatch), the thermal radiationgenerated from the body that is far infrared can pass through theseopenings (through hole H and third opening O3) to enter into the farinfrared temperature sensing device F of the wearable device D15. Thefilter structure 5 can filter out other visible light and only allow thefar infrared to pass through the filter structure 5, and the sensor chip4 receives the far infrared to further conduct the temperaturedetection.

Sixteenth Embodiment

Please refer to FIG. 16. FIG. 16 shows a schematic view of a wearabledevice D16 of a sixteenth embodiment in the instant disclosure. Thewearable device D16 of the sixteenth embodiment of this instantdisclosure has a similar package structure with the wearable device D15of the fifteenth embodiment of this instant disclosure.

The difference between the wearable device D16 of the sixteenthembodiment and the wearable device D15 of the fifteenth embodiment inthis instant disclosure is that, the wearable device D16 of thesixteenth embodiment further includes an infrared passing glue 8 whichis used to fill the through hole H and the third opening O3. Theinfrared passing glue 8 is used to fill into the through hole H and thethird opening O3 to enclose the through hole H and the third opening O3.

In the sixteenth embodiment of this instant disclosure, the through holeH formed by the first opening O1 of the case 1 and the second opening O2of the metal shielding structure 6, and the third opening O3 of thewaterproof structure 7 are filled by the infrared passing glue 8 andenclosed. This can further enhance the product to prevent water vaporand particles in the air from entering into the wearable device D16 ofthis instant disclosure to cause the product to suffer from corrosionand abrasion, so as to lengthen the lifetime of the product. When theuser wears the wearable device D16 of this instant disclosure (e.g.,smartwatch), the thermal radiation generated from the body that is farinfrared can pass through the infrared passing glue 8 to enter into thefar infrared temperature sensing device F of the wearable device D16.The infrared passing glue 8 can filter out the non-infrared light, thefilter structure 5 further filters out other visible light and onlyallows the far infrared passing through the filter structure 5, and thesensor chip 4 receives the far infrared to further conduct thetemperature detection.

Seventeenth Embodiment

Please refer to FIG. 17. FIG. 17 shows a schematic view of a wearabledevice D17 of a seventeenth embodiment in the instant disclosure. Thewearable device D17 of the seventeenth embodiment of this instantdisclosure has similar package structure with the wearable device D15 ofthe fifteenth embodiment of this instant disclosure.

The difference between the wearable device D17 of the seventeenthembodiment and the wearable device D15 of the fifteenth embodiment inthis instant disclosure is that, the waterproof structure 7 of thewearable device D17 of the seventeenth embodiment is disposed betweenthe metal shielding structure 6 and the circuit substrate 2.

In the seventeenth embodiment of this instant disclosure, when the userwears the wearable device D17 of this instant disclosure (e.g.,smartwatch), the thermal radiation generated from the body that is farinfrared can pass through the through hole H formed by the first openingO1 of the case 1 and the second opening O2 of the metal shieldingstructure 6 and the third opening O3 of the waterproof structure 7 toenter into the far infrared temperature sensing device F of the wearabledevice D17. The filter structure 5 can filter out other visible lightand only allow the far infrared to pass through the filter structure 5,and the sensor chip 4 receives the far infrared to further conduct thetemperature detection.

Eighteenth Embodiment

Please refer to FIG. 18. FIG. 18 shows a schematic view of a wearabledevice D18 of an eighteenth embodiment in the instant disclosure. Thewearable device D18 of the eighteenth embodiment of this instantdisclosure has similar package structure with the wearable device D17 ofthe seventeenth embodiment of this instant disclosure.

The difference between the wearable device D18 of the eighteenthembodiment and the wearable device D17 of the seventeenth embodiment inthis instant disclosure is that, the wearable device D18 of theeighteenth embodiment further includes an infrared passing structure 9which is disposed on the circuit substrate 2 and located in thewaterproof structure 7 to completely cover the sensor chip 4 and thefilter structure 5, and to enclose the through hole H and the thirdopening O3. The disposing means of the infrared passing structure 9 inthe eighteenth embodiment can prevent water and air particles enteringinto the wearable device D18 to avoid corrosion and abrasion, so as tolengthen the lifetime of the product. The material of the infraredpassing structure 9 is the same as the abovementioned embodiments, andit is not repeated herein.

In the eighteenth embodiment of this instant disclosure, when the userwears the wearable device D18 of this instant disclosure (e.g.,smartwatch), the thermal radiation generated from the body that is farinfrared can pass through the infrared passing structure 9 to enter intothe far infrared temperature sensing device F of the wearable deviceD18. The infrared passing structure 9 can filter out the non-infraredlight, the filter structure 5 further filters out other visible lightand only allows far infrared to pass through the filter structure 5, andthe sensor chip 4 receives the far infrared to further conduct thetemperature detection.

Nineteenth Embodiment

Please refer to FIG. 19. FIG. 19 shows a schematic view of a wearabledevice D19 of a nineteenth embodiment in the instant disclosure. Thewearable device D19 of the nineteenth embodiment of this instantdisclosure has similar package structure with the wearable device D15 ofthe fifteenth embodiment of this instant disclosure.

The difference between the wearable device D19 of the nineteenthembodiment and the wearable device D15 of the fifteenth embodiment inthis instant disclosure is that, the wearable device D19 of thenineteenth embodiment further includes an infrared passing structure 9which is disposed between the filter structure 5 and the waterproofstructure 7.

In the nineteenth embodiment of this instant disclosure, the throughhole H formed by the first opening O1 of the case 1 and the secondopening O2 of the metal shielding structure 6 and the third opening O3of the waterproof structure 7 allows the far infrared to pass through.When the user wears the wearable device D19 of this instant disclosure(e.g., smartwatch), the thermal radiation generated from the body thatis far infrared can pass through the through hole H to enter into thefar infrared temperature sensing device F of the wearable device D19.First, the far infrared passes through the infrared passing structure 9which filters the non-infrared light, the filter structure 5 thenfilters out other visible light, only the far infrared can pass through,and the sensor chip 4 receives the far infrared to further conduct thetemperature detection.

Twentieth Embodiment

Please refer to FIG. 20. FIG. 20 shows a schematic view of a wearabledevice D20 of a twentieth embodiment in the instant disclosure. Thewearable device D20 of the twentieth embodiment of this instantdisclosure has similar package structure with the wearable device D19 ofthe nineteenth embodiment of this instant disclosure.

The difference between the wearable device D20 of the twentiethembodiment and the wearable device D19 of the nineteenth embodiment inthis instant disclosure is that, the wearable device D20 of thetwentieth embodiment further includes an infrared passing glue 8 whichis used to fill and enclose the through hole H and the third opening O3.

In the twentieth embodiment of this instant disclosure, the through holeH formed by the first opening O1 of the case 1 and the second opening O2of the metal shielding structure 6, and the third opening O3 of thewaterproof structure 7 is filled by the infrared passing glue 8 andenclosed. This can further enhance the product to prevent water vaporand particles in the air entering into the wearable device D20 causingcorrosion and abrasion, so as to lengthen the lifetime of the product.When the user wears the wearable device D20 of this instant disclosure(e.g., smartwatch), the thermal radiation generated from the body thatis far infrared can pass through the infrared passing glue 8 to enterinto the far infrared temperature sensing device F of the wearabledevice D20. First, the far infrared passes through the infrared passingstructure 9 which filters the non-infrared light. The filter structure 5then filters out other visible light, only the far infrared can passthrough, and the sensor chip 4 receives the far infrared to furtherconduct the temperature detection.

Twenty First Embodiment

Please refer to FIG. 21. FIG. 21 shows a schematic view of a wearabledevice D21 of a twenty first embodiment in the instant disclosure. Thetwenty first embodiment of this instant disclosure provides a wearabledevice D21 which includes a case 1 and a far infrared temperaturesensing device F. The case 1 has a first opening O1. The far infraredtemperature sensing device F is disposed inside the case 1 of thewearable device D21, and includes a circuit substrate 2, an assemblystructure 3, a sensor chip 4, a filter structure 5, a metal shieldingstructure 6, and a waterproof structure 7. The circuit substrate 2 isdisposed in the case 1. The assembly structure 3 is disposed on thecircuit substrate 2. The sensor chip 4 is disposed on the assemblystructure 3, and is electrically connected to the assembly structure 3by at least one wire W. The filter structure 5 is disposed above thesensor chip 4. The metal shielding structure 6 is disposed on theassembly structure 3, surrounds the sensor chip 4 and the filterstructure 5, and has a second opening O2 to expose the filter structure5. The waterproof structure 7 is disposed in the first opening O1 of thecase 1 to enclose the case 1, and the waterproof structure 7 can be aninfrared passing structure 9.

Specifically, in the twenty first embodiment of this instant disclosure,the case 1 can be a watch case of a smartwatch. The circuit substrate 2can be a PCB. The assembly structure 3 can be a SMD substrate or a CLCCsubstrate. The sensor chip 4 is a far infrared sensor chip, and the CMOSMEMS process can be used in the sensor chip 4.

In particular, the sensor chip 4 is mainly used to detect the farinfrared which has a wavelength ranging from 15 to 1000 μm. Since livingorganisms feel the heat approximately in this wave band at roomtemperature, the sensor chip 4 is used to detect the temperature of thethermal radiation generated from the far infrared.

Furthermore, the filter structure 5 can be a far infrared filter whichcan allow the far infrared to pass through. In this embodiment, themetal shielding structure 6 in addition can be used to block the noisegenerated from other sensors and external electronic products, andfurther can prevent other far infrared from passing into the case 1 ofthe wearable device D21 affecting the sensing results of the sensor chip4 and decreasing the temperature detection accuracy. Particularly, thematerial of the metal shielding structure 6 is selected from the groupconsisting of silver, copper, aluminum, iron, and other materials whichcan block the noise, but the material of the metal shielding structure 6is not limited in this instant disclosure. Additionally, the waterproofstructure 7 can be a waterproof glue or a waterproof layer that canprevent moisture entering into the wearable device D21 causing corrosionand rusting, and also can prevent air particles entering into thewearable device D21 avoiding abrasion, so as to lengthen the lifetime ofthe product. In the twenty first embodiment of this instant disclosure,the waterproof structure 7 also acts as the infrared passing structure9, in order to allow the far infrared to pass through the waterproofstructure 7 (infrared passing structure 9). The material of thewaterproof structure 7 must be a transparent material which is selectedfrom the group consisting of PE, PP, PET, and other material that farinfrared can pass through.

In the twenty first embodiment of this instant disclosure, the firstopening O1 of the case 1 is enclosed by the waterproof structure 7 tofurther enhance the product to prevent water vapor and particles in theair from entering into the wearable device D21 to avoid corrosion andabrasion, so as to lengthen the lifetime of the wearable device D21.When the user wears the wearable device D21 of this instant disclosure(e.g., smartwatch), the thermal radiation generated from the body thatis far infrared can pass through the waterproof structure 7 to enterinto the far infrared temperature sensing device F of the wearabledevice D21. At this time, the waterproof structure 7 including theinfrared passing structure 9 can filter out the non-infrared light, thefilter structure 5 further filters out other visible light, and onlyallows the far infrared to pass through the filter structure 5 and enterinto the accommodating space R of the assembly structure 3, and thesensor chip 4 receives the far infrared to further conduct thetemperature detection.

Embodiments Efficacy

In summary, the benefit of the instant disclosure is that, in thisinstant disclosure, by the metal shielding structure surrounding theinternal sensing elements (e.g., sensor chip, circuit substrate) in thefar infrared temperature sensing device of the wearable device, it canblock the noise generated from other sensors and external electronicproducts that can avoid interfering with the sensing elements, and toblock other far infrared passing into the case of the wearable devicethat can avoid the sensing result of the sensor chip being affected, soas to increase the detection accuracy on the far infrared temperature.The metal shielding structure further has an opening, it only allows theinfrared at a certain position to enter thereinto, and other partsoutside the opening are blocked by the metal shielding structure andcannot enter into the wearable device. In this way, it can appear asuperior Signal-to-Noise Ratio (SNR). Meanwhile, the detection accuracyon the far infrared temperature can be increased.

The descriptions illustrated supra set forth simply the preferredembodiments of the present invention; however, the characteristics ofthe present invention are by no means restricted thereto. All changes,alterations, or modifications conveniently considered by those skilledin the art are deemed to be encompassed within the scope of the presentinvention delineated by the following claims.

What is claimed is:
 1. A wearable device, comprising: a case having afirst opening; and a far infrared temperature sensing device disposedinside the case of the wearable device, and the far infrared temperaturesensing device including: an assembly structure; a sensor chip which isdisposed on the assembly structure; a filter structure which is disposedabove the sensor chip; and a metal shielding structure which is disposedon the assembly structure and surrounds the sensor chip and the filterstructure, wherein the metal shielding structure has a second opening toexpose the filter structure.
 2. The wearable device as claimed in claim1, wherein the far infrared temperature sensing device furthercomprises: a circuit substrate disposed in the case; and a waterproofstructure disposed in the first opening of the case; wherein thewaterproof structure is used to enclose the case.
 3. The wearable deviceas claimed in claim 1, wherein the sensor chip is electrically connectedto the assembly structure by at least one wire.
 4. The wearable deviceas claimed in claim 2, wherein the waterproof structure is an infraredpassing structure.
 5. The wearable device as claimed in claim 1, whereinthe assembly structure is disposed on the circuit substrate.
 6. Thewearable device as claimed in claim 1, wherein the sensor chip isconfigured to detect a far infrared which has a wavelength ranging from15 to 1000 μm.
 7. The wearable device as claimed in claim 1, wherein thefilter structure is configured to allow the far infrared to passthrough.
 8. The wearable device as claimed in claim 1, wherein the metalshielding structure is configured to block the noise generated fromother sensors and external electronic products, and prevent other farinfrared from passing into the case.
 9. The wearable device as claimedin claim 1, wherein the case is a watch case of a smartwatch, theassembly structure is a SMD substrate or a CLCC substrate, and thesensor chip is a far infrared sensor chip.
 10. The wearable device asclaimed in claim 2, wherein the circuit substrate is a PCB and thewaterproof structure is a waterproof glue or a waterproof layer.